The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Dec. 07, 2012
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Shinsuke Yano, Nagoya, JP;

Takami Hirai, Toyota, JP;

Tsutomu Nanataki, Toyoake, JP;

Hirofumi Yamaguchi, Komaki, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/22 (2006.01); H05K 1/02 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 3/22 (2013.01); H05K 1/0263 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 25/072 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/1126 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A circuit board including a substrate having first and second dielectric layers of first and second dielectrics, the second dielectric containing 8 mass % or more of a glass net former component. At least one portion of an inner layer electrode has approximately two principal surfaces parallel to principal surfaces of the circuit board and a thickness of not less than 50 micrometers in a normal direction of the principal surfaces. The inner layer electrode and second dielectric layer contact with each other, and a ratio t/T of sum total thickness t of the second dielectric layer in contact with the inner layer electrode in a normal direction of the principal surface to sum total thickness T of the first dielectric layer in a normal direction of the principal surface is 0.1 or more.


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