The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Aug. 15, 2013
Applicant:

Dynaloy, Llc, Kingsport, TN (US);

Inventors:

John Atkinson, Fishers, IN (US);

Kimberly Dona Pollard, Anderson, IN (US);

Gene Goebel, Grover Beach, CA (US);

Assignee:

Dynaloy, LLC, Kingsport, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/42 (2006.01); C11D 7/32 (2006.01); C11D 7/34 (2006.01); C11D 7/10 (2006.01); C11D 7/50 (2006.01); C11D 7/26 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
G03F 7/422 (2013.01); C11D 7/3218 (2013.01); C11D 7/10 (2013.01); C11D 7/5009 (2013.01); C11D 7/261 (2013.01); C11D 7/3209 (2013.01); C11D 11/0047 (2013.01); G03F 7/425 (2013.01); G03F 7/426 (2013.01); H01L 21/02071 (2013.01); H01L 21/31133 (2013.01); H01L 21/30604 (2013.01);
Abstract

Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.


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