The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

May. 16, 2011
Applicant:

Narasimhulu Kanike, Wayne, NJ (US);

Inventor:

Narasimhulu Kanike, Wayne, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 27/092 (2006.01); H01L 27/06 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82345 (2013.01); H01L 27/1203 (2013.01); H01L 21/84 (2013.01); H01L 27/0922 (2013.01); H01L 27/0629 (2013.01); H01L 21/823842 (2013.01);
Abstract

Field Effect Transistors (FETs), Integrated Circuit (IC) chips including the FETs, and a method of forming the FETs on ICs. FET locations are defined on a layered semiconductor wafer, preferably a Silicon On Insulator (SOI) wafer. One or more FET locations are defined as silicon gate locations and remaining as Replacement Metal Gate (RMG) FET locations with at least one of each on the IC. Polysilicon gates are formed in all FET locations. Gates in silicon gate locations are tailored, e.g., doped and silicided. Remaining polysilicon gates are replaced with metal in RMG FET locations. FETs are connected together into circuits with RMG FETs being connected to silicon gate FETs.


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