The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Sep. 22, 2014
Xilinx, Inc., San Jose, CA (US);
Matthew H. Klein, Redwood City, CA (US);
Robert W. Wells, Cupertino, CA (US);
Jongheon Jeong, Palo Alto, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
In the disclosed methods, integrated circuit (IC) dice are manufactured from a common specification, and the IC dice are tested for defective circuitry. Respective defect sets are generated to indicate defective circuitry in the IC die. The dice are assigned to bins based on the respective defect sets. For each bin, all IC dice assigned to the bin have equivalent respective defect sets. Product definitions are provided, and each product definition indicates a respective set of circuitry required for a corresponding product. Respective sets of packages are manufactured for each product. In the manufacturing of each package of a respective set of packages for each product, one or more IC dice are selected from a subset of the plurality of bins such that the IC dice have respective defect sets allowed by the product definition of the product. The selected IC dice are then manufactured into the package.