The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Apr. 21, 2010
Applicants:

Michitaka Hattori, Nagoya, JP;

Satoshi Imaeda, Nagoya, JP;

Toshihiko Kariya, Nagoya, JP;

Inventors:

Michitaka Hattori, Nagoya, JP;

Satoshi Imaeda, Nagoya, JP;

Toshihiko Kariya, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01); B29C 45/78 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7306 (2013.01); B29C 45/7312 (2013.01); B29C 45/78 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/76304 (2013.01); B29C 2945/76531 (2013.01); B29C 2945/76933 (2013.01);
Abstract

The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.


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