The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Mar. 03, 2011
Applicants:

Kevin M. Kenney, San Jose, CA (US);

Peter N. Russell-clarke, San Francisco, CA (US);

Inventors:

Kevin M. Kenney, San Jose, CA (US);

Peter N. Russell-Clarke, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/34 (2006.01); B29C 53/56 (2006.01); B65H 81/00 (2006.01); B29C 70/32 (2006.01); H05K 5/00 (2006.01); B29C 53/84 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 70/32 (2013.01); B29C 53/562 (2013.01); B29C 53/564 (2013.01); B29C 53/845 (2013.01); B29C 70/347 (2013.01); B29L 2031/3437 (2013.01); B29L 2031/3481 (2013.01); H05K 5/0008 (2013.01);
Abstract

A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.


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