The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Apr. 16, 2012
Applicants:

Kouki Itoyama, Odawara, JP;

Fumio Miyazawa, Gotemba, JP;

Inventors:

Kouki Itoyama, Odawara, JP;

Fumio Miyazawa, Gotemba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); C08J 9/12 (2006.01); C08G 18/48 (2006.01); C08G 18/10 (2006.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); C08G 101/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); C08J 9/12 (2013.01); C08J 2375/04 (2013.01); C08G 18/4854 (2013.01); C08G 18/10 (2013.01); C08G 2101/0008 (2013.01); C08G 2101/0083 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); C08J 2207/00 (2013.01);
Abstract

Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm.


Find Patent Forward Citations

Loading…