The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Apr. 10, 2014
Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding headfor pressing an electronic componentagainst a substrateto bond it to the substrate; a plurality of load detection mechanisms (e.g., load sensors) substantially equally spaced so as to face one another under a substrate stage S supporting the substrateprovided with the electronic component; and a pressure detection unitfor detecting pressing force at the bonding surface between the electronic componentand substrateon the basis of the pressure values detected by the individual load detection mechanisms