The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Mar. 09, 2012
Applicants:

John Seymour, Ann Arbor, MI (US);

Jamille Hetke, Brooklyn, MI (US);

Rio Vetter, Ypsilanti, MI (US);

Daryl Kipke, Dexter, MI (US);

David Pellinen, Ann Arbor, MI (US);

Kc Kong, Ann Arbor, MI (US);

Inventors:

John Seymour, Ann Arbor, MI (US);

Jamille Hetke, Brooklyn, MI (US);

Rio Vetter, Ypsilanti, MI (US);

Daryl Kipke, Dexter, MI (US);

David Pellinen, Ann Arbor, MI (US);

Kc Kong, Ann Arbor, MI (US);

Assignee:

NeuroNexus Technologies, Inc., Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/04 (2006.01); A61N 1/05 (2006.01); A61B 1/07 (2006.01); A61M 25/00 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0534 (2013.01); A61N 1/0553 (2013.01); H05K 1/118 (2013.01); A61B 1/07 (2013.01); A61M 25/0023 (2013.01); H05K 3/10 (2013.01); H05K 1/028 (2013.01); H05K 2201/051 (2013.01);
Abstract

The neural interface system of one embodiment includes a cylindrical shaft, a lateral extension longitudinally coupled to at least a portion of the shaft and having a thickness less than a diameter of the shaft, and an electrode array arranged on the lateral extension and radially offset from the shaft, including electrode sites that electrically interface with their surroundings. The method of one embodiment for making the neural interface system includes forming a planar polymer substrate with at least one metallization layer, patterning on at least one metallization layer an electrode array on a first end of the substrate, patterning conductive traces on at least one metallization layer, rolling a portion of the substrate toward the first end of the substrate, and securing the rolled substrate into a shaft having the first end of the substrate laterally extending from the shaft and the electrode array radially offset from the shaft.


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