The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Nov. 16, 2011
Applicants:

Motoaki Tamaya, Tokyo, JP;

Akira Yokoyama, Tokyo, JP;

Inventors:

Motoaki Tamaya, Tokyo, JP;

Akira Yokoyama, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/091 (2006.01); H01S 3/02 (2006.01); H01S 3/063 (2006.01); H01S 3/0941 (2006.01); H01S 3/04 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 3/025 (2013.01); H01S 3/0632 (2013.01); H01S 3/0941 (2013.01); H01S 3/0405 (2013.01); H01S 5/0224 (2013.01); H01S 5/02272 (2013.01); H01S 5/02438 (2013.01); H01S 5/02476 (2013.01); H01S 5/4031 (2013.01);
Abstract

A semiconductor laser excitation solid-state laser comprises: a planar waveguide-type solid-state laser element which is disposed on a solid-state laser substrate; an LD array; and a sub-mount substrate on which joining layers of two different thicknesses are formed on the same plane; wherein the planar waveguide-type solid-state laser element is joined to the sub-mount substrate on the surface on the opposite side of a surface on which the solid-state laser substrate is mounted, via a joining layer of one of the thicknesses out of the joining layers of the two different thicknesses, and the LD array is joined to the sub-mount substrate on the surface on a light-emitting layer side, via another joining layer of the other thickness out of the joining layers of the two different thicknesses.


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