The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
May. 12, 2010
Applicants:
Gen Nagaoka, Osaka, JP;
Yasuhiro Hida, Osaka, JP;
Hiroki Miyazaki, Osaka, JP;
Inventors:
Assignee:
Sharp Kabushiki Kaisha, Osaka-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H01L 29/18 (2006.01); H01L 33/00 (2010.01); G09G 3/36 (2006.01); G02F 1/1345 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); G02F 1/13454 (2013.01); G02F 2202/28 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/07811 (2013.01);
Abstract
Affixed to a projection () of a glass substrate () included in a liquid crystal module () are a first ACF (), which has low surface tack strength but high connection reliability, and a second ACF (), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (), electronic components (), etc., are mounted on the glass substrate (), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.