Using dielectric substrates, embedded with vertical wire structures, with slotline and microstrip elements to eliminate parallel-plate or surface-wave radiation in printed-circuits, chip packages and antennas

Abstract

Substrate arrangements useful for high-performance radio-frequency planar circuits and antennas eliminate excitation of parallel-plate or surface-wave radiations. By eliminating such radiation which escapes sideways through the substrates, the loss of valuable power carried away by these radiations can be avoided, and/or complications resulting from these radiations (e.g., in the form or electromagnetic interference, cross-talk between circuit components or poor signal integrity) can be avoided. A new type of substrate layer is embedded with thin conducting wires that are closely packed and oriented normal to the substrate layering. These conducting wires change the substrate behavior in a unique way. Such new substrate layers may be used in slotline/coplanar waveguide circuits and microstrip antennas to achieve high-performance radio-frequency operations.