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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9007161 B1

PDFFull Text
Date of Patent:
Apr. 14, 2015

Filed:

Jul. 24, 2014

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Koji Sato, Nagaokakyo, JP;

Yukio Sanada, Nagaokakyo, JP;

Yasuhiro Nishisaka, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co. Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Tuyen Nguyen

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01C 1/14 (2006.01); H01C 7/00 (2006.01); H01C 7/02 (2006.01); H01G 2/06 (2006.01); H01G 4/228 (2006.01); H01F 27/28 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01L 41/083 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49085 (2015.01); Y10T 29/49126 (2015.01); H01C 1/14 (2013.01); H01C 7/008 (2013.01); H01C 7/02 (2013.01); H01G 2/06 (2013.01); H01G 4/228 (2013.01); H05K 1/186 (2013.01); H05K 3/321 (2013.01); H05K 2201/10636 (2013.01); H01F 27/2804 (2013.01); H01F 2027/2809 (2013.01); H01G 4/008 (2013.01); H01G 4/1227 (2013.01); H01L 41/083 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10439 (2013.01);
Abstract

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

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