The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Jul. 02, 2013
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Toshihiko Watanabe, Kanagawa, JP;

Yoichi Ohshige, Kanagawa, JP;

Masato Doi, Kanagawa, JP;

Akiyoshi Aoyagi, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/50 (2006.01); H01L 51/52 (2006.01); H01L 23/495 (2006.01); H01L 25/075 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0289 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.


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