The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Aug. 31, 2012
Applicants:

Takahiro Niiyama, Kagoshima, JP;

Hironobu Shintoku, Kagoshima, JP;

Ryoma Sasagawa, Kagoshima, JP;

Jumpei Komura, Kagoshima, JP;

Inventors:

Takahiro Niiyama, Kagoshima, JP;

Hironobu Shintoku, Kagoshima, JP;

Ryoma Sasagawa, Kagoshima, JP;

Jumpei Komura, Kagoshima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/13 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/831 (2013.01); H01L 2224/8138 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/83 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81815 (2013.01); H03H 9/0514 (2013.01); H03H 9/0547 (2013.01); H03H 9/0552 (2013.01); H01L 2924/3841 (2013.01); H01L 23/13 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A piezoelectric deviceis provided with an element-mounting member, a piezoelectric elementmounted on the element-mounting member, a metal patternwhich is formed at the surface of the element-mounting memberand includes an element-mounting regionand a lead region, and an integrated circuit elementwhich is electrically connected to the element-mounting regionof the metal patternby solder bump, wherein the metal patternhas a projecting partwhich is provided between the element-mounting regionand the lead region, and at least the surface portion of the projecting partis made of a metal oxide.


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