The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Jan. 07, 2014
Applicant:

Stmicroelectronics (Rousset) Sas, Rousset, FR;

Inventor:

Antonio Di-Giacomo, Rousset, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/84 (2006.01); H01L 23/528 (2006.01); H05K 7/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H05K 7/02 (2013.01); B81C 1/00246 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0145 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0735 (2013.01);
Abstract

An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.


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