The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Nov. 12, 2012
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventor:
Jaydutt J. Joshi, Irvine, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/50 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/50 (2013.01); H01L 23/498 (2013.01); H01L 2224/16225 (2013.01); H01L 23/3121 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/49816 (2013.01);
Abstract
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.