The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Sep. 05, 2013
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hiroshi Fukuyoshi, Hyogo-ken, JP;

Junichi Nakao, Hyogo-ken, JP;

Yoshiki Endo, Hyogo-ken, JP;

Eitaro Miyake, Hyogo-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 24/34 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01);
Abstract

An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.


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