The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Jul. 20, 2011
Applicants:

Aline Welter, Eisenach, DE;

Alexander Lux, Ostfildern, DE;

Christoph Gmelin, Stuttgart, DE;

Jens Vollert, Muehlhausen, DE;

Reinhold Herrmann, Stuttgart, DE;

Eckart Schellkes, Kirchentellinsfurt, DE;

Inventors:

Aline Welter, Eisenach, DE;

Alexander Lux, Ostfildern, DE;

Christoph Gmelin, Stuttgart, DE;

Jens Vollert, Muehlhausen, DE;

Reinhold Herrmann, Stuttgart, DE;

Eckart Schellkes, Kirchentellinsfurt, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01L 19/06 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); G01L 19/0627 (2013.01); G01L 19/0084 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/10253 (2013.01);
Abstract

In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.


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