The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Mar. 31, 2010
Applicant:

Byoung Gu Cho, Seoul, KR;

Inventor:

Byoung gu Cho, Seoul, KR;

Assignee:

Lightizer Korea Co., Seoul, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/00 (2006.01); H01L 25/075 (2006.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/507 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The present invention provides a multichip LED and method of manufacture in which white light is produced. Specifically, a plurality of electrically interconnected LED chips (e.g., interconnected via red metal wire) is selected for conversion of light to white light. In a typical embodiment, the LED chips comprise: a blue LED chip, a red LED chip, a green LED chip, and a target LED chip whose light output is converted to white light. A wavelength of a light output by one or more of the plurality of chips will be measured. Based on the wavelength measurement, a conformal coating is applied to the one or more of the LED chips. The conformal coating has a phosphor ratio that is based on the wavelength. Moreover, the phosphor ratio is comprised of at least one of the following colors: yellow, green, or red. Using the conformal coating the light output of the target LED is then converted to white light. In a typical embodiment, these steps are performed at the wafer level so that uniformity and consistency in results can be better obtained. Several different approaches can be implemented for isolating the coating area. Examples include the use of a paraffin wax, a silk screen, or a photo resist. Regardless, this approach allows multiple chips to be treated simultaneously.


Find Patent Forward Citations

Cho, Byoung. (2015). Multichip light emitting diode (led) and method of manufacture (U.S. Patent No. 9006754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9006754

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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