The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Mar. 22, 2011
Applicants:

Satoshi Hirono, Shiga, JP;

Manabu Ikoma, Kyoto, JP;

Naoto Inoue, Shiga, JP;

Tsuyoshi Miyata, Kyoto, JP;

Kazunari Komai, Stuttgart, DE;

Inventors:

Satoshi Hirono, Shiga, JP;

Manabu Ikoma, Kyoto, JP;

Naoto Inoue, Shiga, JP;

Tsuyoshi Miyata, Kyoto, JP;

Kazunari Komai, Stuttgart, DE;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 31/0203 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48472 (2013.01); H01L 31/02325 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.


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