The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Dec. 05, 2011
Daniel Javier Julve Sebastian, Saragossa, ES;
Maria Martinez Falcon, Saragossa, ES;
Jose Ramos Escribano, Saragossa, ES;
Jorge Perez Cacho, Saragossa, ES;
Miguel Menedez Sastre, Saragossa, ES;
Joaquin Coronas Ceresuela, Saragossa, ES;
MA Pilar Bernal Paredes, Saragossa, ES;
Daniel Javier Julve Sebastian, Saragossa, ES;
Maria Martinez Falcon, Saragossa, ES;
Jose Ramos Escribano, Saragossa, ES;
Jorge Perez Cacho, Saragossa, ES;
Miguel Menedez Sastre, Saragossa, ES;
Joaquin Coronas Ceresuela, Saragossa, ES;
Ma Pilar Bernal Paredes, Saragossa, ES;
Industrias Quimicas del Ebro, S.A., Saragossa, ES;
Abstract
The present invention describes a reinforcing filler for rubber comprising the synergistic combination of precipitated silica with a pore structure defined by a maximum between 25 nm and 35 nm, a total pore volume between 1.3 cm/g and 1.6 cm/g, and a compression factor between 1.3 10and 2.3 10MPa, and at least one crystalline alkaline silicate corresponding to the general formula of the crystalline alkaline silicates, said crystalline alkaline silicate being swelled and/or layered in the presence of an organic cationic compound in the form of ammonium salt of the +NRtype according to the formula [CHN(CH)]. The rubber formulation obtained by this reinforcing filler composition does present a great reduction of energy dissipated in the tread without compromising the abrasion resistance and elastic modulus properties.