The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Mar. 05, 2012
Applicants:

Chien-min Sung, Tansui, TW;

Ming-chi Kan, Rende Township, TW;

Shao Chung HU, Xindian, TW;

Inventors:

Chien-Min Sung, Tansui, TW;

Ming-Chi Kan, Rende Township, TW;

Shao Chung Hu, Xindian, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 33/64 (2010.01); H01L 23/373 (2006.01); H01L 33/28 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 23/3732 (2013.01); H01L 23/3733 (2013.01); H01L 2933/0075 (2013.01); H01L 33/28 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/° C.


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