The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9006005 B1

Date of Patent:

Apr. 14, 2015

Filed:

Apr. 14, 2014

Flip light emitting diode chip and method of fabricating the same

Applicant:

Starlite Led Inc, Fremont, CA (US);

Inventors:

Chang Han, Pleasanton, CA (US);

Pao Chen, Milpitas, CA (US);

Assignee:

Starlite Led Inc, Fremont, CA (US);

Attorney:

Alston & Bird LLP

Primary Examiner:

Luan C Thai

Int. Cl.

CPC ...

H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 29/267 (2006.01); H01L 31/12 (2006.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/12 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 25/16 (2006.01); H01L 33/38 (2010.01); H01L 51/52 (2006.01); H01L 33/08 (2010.01); H01L 33/40 (2010.01);

U.S. Cl.

CPC ...

H01L 33/32 (2013.01); H01L 33/0075 (2013.01); H01L 33/0066 (2013.01); H01L 33/12 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/167 (2013.01); H01L 33/382 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 51/5237 (2013.01); H01L 51/5253 (2013.01); H01L 33/08 (2013.01); H01L 33/405 (2013.01); H01L 2933/0016 (2013.01); H01L 2224/48091 (2013.01);

Abstract

A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.

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