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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9005876 B1

PDFFull Text
Date of Patent:
Apr. 14, 2015

Filed:

Dec. 20, 2013

Positive photosensitive resin composition for spray coating and method for producing through electrode using the same

Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Hideki Orihara, Tokyo, JP;

Toshio Banba, Tokyo, JP;

Assignee:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Attorney:

Ditthavong & Steiner, P.C.

Primary Examiner:

Caleen Sullivan

Int. Cl.
CPC ...
G03F 7/26 (2006.01); H01L 21/768 (2006.01); C08G 73/22 (2006.01); C09D 7/00 (2006.01); C09D 179/04 (2006.01); C09D 179/08 (2006.01); H01L 21/312 (2006.01); G03F 7/004 (2006.01); G03F 7/023 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76825 (2013.01); C08G 73/22 (2013.01); C09D 7/001 (2013.01); C09D 179/04 (2013.01); C09D 179/08 (2013.01); H01L 21/312 (2013.01); H01L 21/76898 (2013.01); G03F 7/0048 (2013.01); G03F 7/0233 (2013.01); G03F 7/16 (2013.01); H01L 21/76831 (2013.01);
Abstract

A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern.

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