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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9005761 B1

PDFFull Text
Date of Patent:
Apr. 14, 2015

Filed:

Dec. 22, 2011

Halogen-free resin composition and its application for copper clad laminate and printed circuit board

Applicant:

Yu-te Lin, Tao-Yuan Hsien, TW;

Inventor:

Yu-Te Lin, Tao-Yuan Hsien, TW;

Assignee:

Elite Material Co., Ltd., Tao-Yuan Hsien, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08G 59/20 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); B32B 27/20 (2006.01); C08G 59/42 (2006.01); C08L 35/06 (2006.01); C08L 79/04 (2006.01); C08G 73/02 (2006.01); C08L 79/02 (2006.01); C08K 5/00 (2006.01); C08K 5/49 (2006.01);
U.S. Cl.
CPC ...
C08G 59/56 (2013.01); B32B 15/092 (2013.01); B32B 27/04 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); H05K 1/0366 (2013.01); C08L 35/06 (2013.01); C08L 79/04 (2013.01); C08G 73/0233 (2013.01); C08L 79/02 (2013.01); C08G 59/4284 (2013.01); C08L 63/00 (2013.01); H05K 1/0346 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); C08K 5/0025 (2013.01); C08K 5/49 (2013.01); Y10S 428/901 (2013.01);
Abstract

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

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