The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Jun. 14, 2012
Applicant:
Hidemasa Kawai, Nagaokakyo, JP;
Inventor:
Hidemasa Kawai, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01); H01L 23/58 (2006.01); B32B 3/30 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); B24B 19/02 (2006.01); B24B 7/22 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); B32B 3/30 (2013.01); H01L 21/56 (2013.01); H01L 21/67092 (2013.01); H01L 23/24 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); B24B 19/028 (2013.01); B24B 7/228 (2013.01);
Abstract
An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals in a cover layer provided on a substrate by repeating grinding with a rotary blade at a pitch more than a thickness W of the rotary blade. Next, at least portions provided in the cover layer along the first grooves are removed to reduce the thickness of the cover layer by repeating grinding at a pitch equal to or less than the thickness W of the rotary blade.