The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Sep. 14, 2011
Thomas Waechtler, Chemnitz, DE;
Stefan Schulz, Chemnitz, DE;
Thomas Gessner, Chemnitz, DE;
Steve Mueller, Reinsdorf, DE;
André Tuchscherer, Chemnitz, DE;
Heinrich Lang, Chemnitz-Harthau, DE;
Thomas Waechtler, Chemnitz, DE;
Stefan Schulz, Chemnitz, DE;
Thomas Gessner, Chemnitz, DE;
Steve Mueller, Reinsdorf, DE;
André Tuchscherer, Chemnitz, DE;
Heinrich Lang, Chemnitz-Harthau, DE;
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V., Munich, DE;
Technische Universitaet Chemnitz, Chemnitz, DE;
Abstract
A method for producing a substrate with a copper or a copper-containing coating is disclosed. The method comprises a first step wherein a first precursor, a second precursor and a substrate are provided. The first precursor is a copper complex that contains no fluorine and the second precursor is selected from a ruthenium complex, a nickel complex, a palladium complex or mixtures thereof. In the second step, a layer is deposited at least on partial regions of a surface of the substrate by using the first precursor and the second precursor by means of atomic layer deposition (ALD). The molar ratio of the first precursor:second precursor used for the ALD extends from 90:10 to 99.99:0.01. The obtained layer contains copper and at least one of ruthenium, nickel and palladium. Finally, a reduction is performed step in which a reducing agent acts on the substrate obtained after depositing the copper-containing layer.