The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Feb. 09, 2005
Applicants:

Takashi Shikida, Sakai, JP;

Shinji Ogama, Iwaki, JP;

Yoshiaki Ikeda, Iwaki, JP;

Kazuhisa Hidaka, Sakai, JP;

Inventors:

Takashi Shikida, Sakai, JP;

Shinji Ogama, Iwaki, JP;

Yoshiaki Ikeda, Iwaki, JP;

Kazuhisa Hidaka, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 23/04 (2006.01); C04B 35/622 (2006.01); C01G 23/00 (2006.01); C01G 25/00 (2006.01); C01G 27/00 (2006.01); C04B 35/465 (2006.01); C04B 35/468 (2006.01); C04B 35/47 (2006.01); C04B 35/48 (2006.01); C04B 35/49 (2006.01); C04B 35/626 (2006.01); H01B 3/12 (2006.01);
U.S. Cl.
CPC ...
C01G 23/003 (2013.01); C01G 23/006 (2013.01); C01G 25/00 (2013.01); C01G 25/006 (2013.01); C01G 27/00 (2013.01); C01P 2002/34 (2013.01); C04B 35/465 (2013.01); C04B 35/4682 (2013.01); C04B 35/47 (2013.01); C04B 35/48 (2013.01); C04B 35/49 (2013.01); C04B 35/62655 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3205 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3249 (2013.01); C04B 2235/441 (2013.01); C04B 2235/449 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/5481 (2013.01); C04B 2235/72 (2013.01); C04B 2235/724 (2013.01); C04B 2235/768 (2013.01); H01B 3/12 (2013.01);
Abstract

The invention provides a process for production of powder of perovskite compound which comprises: The process makes it unnecessary to resort to a conventional mechanical crushing means or to make use of impact caused by milling media or airflow, but it makes possible to obtain a powder of perovskite compound which is not contaminated with impurities derived from milling media or chipping particles but has a high purity and a narrow particle size distribution.


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