The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Oct. 09, 2012
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Tadashi Omatsu, Shizuoka-ken, JP;

Satoshi Wakamatsu, Shizuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); C08F 2/46 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); C08F 2/54 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
C08F 2/46 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); C08F 2/54 (2013.01); H01L 21/3086 (2013.01);
Abstract

A resist layer constituted by a resist composition (which may include unavoidable impurities) including a polymerizable compound that includes polyfunctional monomers that become polymers having three dimensional structures by cross linking when polymerized and a polymerization initiating agent which is activated by one of light and an electron beam is formed on a substrate. A surface of a mold having a predetermined pattern of protrusions and recesses is pressed against the resist layer. Light is irradiated onto the resist layer to cure the resist layer. The mold is separated from the resist layer under conditions that the temperature of the resist layer is 40° C. or greater.


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