The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Jun. 17, 2010
Junichi Kurita, Osaka, JP;
Hiroshi Takahashi, Kyoto, JP;
Kenji Kuranuki, Kyoto, JP;
Motoaki Morioka, Osaka, JP;
Keizo Nakagawa, Osaka, JP;
Masashi Minakuchi, Hyogo, JP;
Yukihiro Shimasaki, Hyogo, JP;
Junichi Kurita, Osaka, JP;
Hiroshi Takahashi, Kyoto, JP;
Kenji Kuranuki, Kyoto, JP;
Motoaki Morioka, Osaka, JP;
Keizo Nakagawa, Osaka, JP;
Masashi Minakuchi, Hyogo, JP;
Yukihiro Shimasaki, Hyogo, JP;
Abstract
A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.