The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Dec. 16, 2010
Applicants:

Michimasa Ote, Saitama, JP;

Takashi Gonda, Saitama, JP;

Junya Ishida, Saitama, JP;

Kenro Takizawa, Saitama, JP;

Kazuhiro Suzuki, Saitama, JP;

Yuzo Morioka, Saitama, JP;

Inventors:

Michimasa Ote, Saitama, JP;

Takashi Gonda, Saitama, JP;

Junya Ishida, Saitama, JP;

Kenro Takizawa, Saitama, JP;

Kazuhiro Suzuki, Saitama, JP;

Yuzo Morioka, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/10 (2006.01); B29C 47/94 (2006.01); B29C 47/92 (2006.01); B29C 47/00 (2006.01); B29C 47/88 (2006.01); C08J 5/18 (2006.01); C08L 79/08 (2006.01); H01G 4/18 (2006.01); H01G 13/00 (2013.01); B29C 47/14 (2006.01); B29K 79/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 47/10 (2013.01); B29C 47/0021 (2013.01); B29C 47/8845 (2013.01); B29C 47/92 (2013.01); C08J 5/18 (2013.01); C08L 79/08 (2013.01); H01G 4/18 (2013.01); H01G 13/00 (2013.01); B29C 47/14 (2013.01); B29C 2947/92152 (2013.01); B29C 2947/922 (2013.01); B29C 2947/92228 (2013.01); B29C 2947/92238 (2013.01); B29C 2947/92285 (2013.01); B29C 2947/92342 (2013.01); B29C 2947/92438 (2013.01); B29C 2947/92447 (2013.01); B29C 2947/9259 (2013.01); B29C 2947/92923 (2013.01); B29K 2079/085 (2013.01); B29K 2105/256 (2013.01); C08J 2379/08 (2013.01); B29C 47/0004 (2013.01); B29C 47/1072 (2013.01);
Abstract

When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portionof a T-die, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die. Having been covered with a very thin filmof the simple polyetherimide resin, on a flow passage face of the lip portionof the T-die, a resin composition layerincluding a polyetherimide resin and a fluorine resin, which has affinity with the film, is then formed at a center part.


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