The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Dec. 20, 2007
Applicants:

Klaus Tomantschger, Mississauga, CA;

Glenn Hibbard, Toronto, CA;

Gino Palumbo, Toronto, CA;

Iain Brooks, Toronto, CA;

Jonathan Mccrea, Toronto, CA;

Fred Smith, Hannon, CA;

Inventors:

Klaus Tomantschger, Mississauga, CA;

Glenn Hibbard, Toronto, CA;

Gino Palumbo, Toronto, CA;

Iain Brooks, Toronto, CA;

Jonathan McCrea, Toronto, CA;

Fred Smith, Hannon, CA;

Assignee:

Integran Technologies Inc., Mississagua, Ontario, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/18 (2006.01); C25D 15/02 (2006.01); C25D 1/00 (2006.01); C25D 5/02 (2006.01); C25D 5/08 (2006.01); C25D 5/10 (2006.01); C25D 5/14 (2006.01); C25D 5/16 (2006.01); C25D 15/00 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01); C25D 21/14 (2006.01); C25D 17/00 (2006.01); C23C 14/34 (2006.01); C25D 5/00 (2006.01); C25D 7/00 (2006.01); C25D 1/02 (2006.01); C25D 1/04 (2006.01);
U.S. Cl.
CPC ...
C25D 15/02 (2013.01); C25D 1/00 (2013.01); C25D 5/022 (2013.01); C25D 5/08 (2013.01); C25D 5/10 (2013.01); C25D 5/14 (2013.01); C25D 5/16 (2013.01); C25D 5/18 (2013.01); C25D 15/00 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); C25D 21/14 (2013.01); C25D 17/008 (2013.01); C23C 14/3414 (2013.01); C25D 5/00 (2013.01); C25D 7/00 (2013.01); C25D 1/02 (2013.01); C25D 1/04 (2013.01);
Abstract

Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.


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