The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Jun. 22, 2012
Takeshi Tsuno, Yokohama, JP;
Takayuki Goto, Yokohama, JP;
Masato Kinouchi, Yokohama, JP;
Satoshi Tawara, Yokohama, JP;
Jun Utsumi, Yokohama, JP;
Yoichiro Tsumura, Hiroshima, JP;
Kensuke Ide, Ritto, JP;
Takenori Suzuki, Ritto, JP;
Takeshi Tsuno, Yokohama, JP;
Takayuki Goto, Yokohama, JP;
Masato Kinouchi, Yokohama, JP;
Satoshi Tawara, Yokohama, JP;
Jun Utsumi, Yokohama, JP;
Yoichiro Tsumura, Hiroshima, JP;
Kensuke Ide, Ritto, JP;
Takenori Suzuki, Ritto, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.