The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Aug. 04, 2009
Applicants:

Toru Sugiyama, Aichi-gun, JP;

Yoshinori Shibata, Nagoya, JP;

Inventors:

Toru Sugiyama, Aichi-gun, JP;

Yoshinori Shibata, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/44 (2006.01); B29C 65/46 (2006.01); B29C 65/00 (2006.01); B29C 65/16 (2006.01); B29C 65/18 (2006.01); B29K 305/00 (2006.01); B29K 305/02 (2006.01); B29K 305/10 (2006.01); B29K 305/12 (2006.01); B29L 31/00 (2006.01); B29C 65/08 (2006.01); B29C 65/10 (2006.01); B29C 65/14 (2006.01); B29C 65/30 (2006.01); B29C 65/32 (2006.01); B29C 65/36 (2006.01); B29C 65/72 (2006.01); B29C 65/06 (2006.01);
U.S. Cl.
CPC ...
B29C 66/742 (2013.01); B29C 65/18 (2013.01); B29C 65/44 (2013.01); B29C 65/46 (2013.01); B29C 66/02242 (2013.01); B29C 66/30325 (2013.01); B29C 66/342 (2013.01); B29C 66/3474 (2013.01); B29C 66/348 (2013.01); B29C 66/3492 (2013.01); B29C 66/83413 (2013.01); B29C 66/91921 (2013.01); B29C 66/91951 (2013.01); B29C 2793/0036 (2013.01); B29C 2793/0045 (2013.01); B29C 2793/0054 (2013.01); B29C 2793/0081 (2013.01); B29K 2305/00 (2013.01); B29K 2305/02 (2013.01); B29K 2305/10 (2013.01); B29K 2305/12 (2013.01); B29L 2031/737 (2013.01); B29L 2031/7374 (2013.01); B29C 66/91413 (2013.01); B29C 66/91423 (2013.01); B29C 66/91443 (2013.01); B29C 66/91933 (2013.01); B29C 66/91935 (2013.01); B29C 65/08 (2013.01); B29C 65/10 (2013.01); B29C 65/1412 (2013.01); B29C 65/1635 (2013.01); B29C 65/168 (2013.01); B29C 65/1683 (2013.01); B29C 65/30 (2013.01); B29C 65/32 (2013.01); B29C 65/3644 (2013.01); B29C 65/3656 (2013.01); B29C 65/3676 (2013.01); B29C 65/72 (2013.01); B29C 66/02245 (2013.01); B29C 66/028 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/30322 (2013.01); B29C 66/41 (2013.01); B29C 66/43 (2013.01); B29C 66/45 (2013.01); B29C 66/81419 (2013.01); B29C 66/81811 (2013.01); B29C 65/06 (2013.01); B29C 2791/009 (2013.01);
Abstract

A joining method for joining a resin member and a metal member by heating is provided. Joining of the resin member and metal member is performed by heating a joining interface of the resin member and metal member to a temperature in a range of equal to or higher than a decomposition temperature of the resin member and lower than a temperature at which gas bubbles are generated in the resin member and by cooling a surface of the resin member on the opposite side from a joining surface thereof with the metal member to a temperature that is lower than the melting point of the resin member.


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