The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Dec. 27, 2012
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yuzuru Shimazaki, Naka-gun, JP;

Ryuta Washiya, Hitachi, JP;

Masahiko Ogino, Hitachi, JP;

Akihiro Miyauchi, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 46/00 (2006.01); B01D 71/06 (2006.01); B01D 69/10 (2006.01); B01D 63/08 (2006.01); B01D 67/00 (2006.01); B01D 69/06 (2006.01); B01D 39/14 (2006.01);
U.S. Cl.
CPC ...
B01D 46/0002 (2013.01); B01D 71/06 (2013.01); B01D 69/10 (2013.01); B01D 63/08 (2013.01); B01D 67/0023 (2013.01); B01D 69/06 (2013.01); B01D 63/088 (2013.01); B01D 63/081 (2013.01); B01D 63/087 (2013.01); B01D 2325/028 (2013.01); B01D 39/14 (2013.01);
Abstract

The present invention is characterized in that a filter made of resin comprises a through-hole film portion (); and a structure reinforce portion (), wherein a through-hole () is provided in a through-hole film portion (), the thickness of the through-hole film portion () is from 0.5 to 2.0 μm, the bore of the through-hole () is from 0.05 to 0.5 μm, the thickness of the structure reinforce portion () is bigger than the thickness of the through-hole film portion (), the structure reinforce portion () encloses the through-hole film portion (), a damage-reduction structure is provided on the upper surface of the structure reinforce portion (), and wherein, the damage-reduction structure may be an uneven structures.


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