The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Jul. 31, 2013
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Raymond Charles Cady, Horseheads, NY (US);

Michael John Moore, Corning, NY (US);

Mark Alex Shalkey, Corning, NY (US);

Mark Andrew Stocker, Holcot, GB;

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 13/02 (2006.01); B24B 37/20 (2012.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 13/02 (2013.01); B24B 37/20 (2013.01); B24D 18/0009 (2013.01);
Abstract

Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.


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