The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Feb. 01, 2010
Applicants:

Toshihiro Niitsu, Machida, JP;

Masako Nishikawa, Yamato, JP;

Inventors:

Toshihiro Niitsu, Machida, JP;

Masako Nishikawa, Yamato, JP;

Assignee:

Molex Incorporated, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 3/36 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H05K 1/0239 (2013.01); H05K 2201/0187 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/1147 (2013.01); Y10S 439/95 (2013.01);
Abstract

A connector assembly utilizes improved capacitive coupling for connecting together electrical circuits on two substrates (). The connector assembly includes first () and second () connectors respectively attached to first and second circuit substrates. The first connector includes a plurality of first conductors () connected to circuits () on the first circuit substrate and these conductors have exposed contact surfaces with a dielectric material () disposed thereon. The first conductors and associated dielectric material confront second, opposing conductors () supported by the second connector frame when the connector frames are engaged together. A liquid dielectric material () is interposed between the terminals and the dielectric portions that fills minute gaps which may occur in the dielectric portions to improve the capacitive coupling ability of the connector assembly.


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