The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Oct. 26, 2011
Heinz Humele, Thalmassing, DE;
Klaus Voth, Obertraubling, DE;
Johann Zimmerer, Bernhardswald, DE;
Dieter Finger, Neutraubling, DE;
Martin Seger, Neumarkt in der Oberpfalz, DE;
Christoph Klenk, Wenzenbach, DE;
Konrad Senn, Regensburg, DE;
Frank Winzinger, Regensburg, DE;
Alexandra Donhauser, Regensburg, DE;
Heinz Humele, Thalmassing, DE;
Klaus Voth, Obertraubling, DE;
Johann Zimmerer, Bernhardswald, DE;
Dieter Finger, Neutraubling, DE;
Martin Seger, Neumarkt in der Oberpfalz, DE;
Christoph Klenk, Wenzenbach, DE;
Konrad Senn, Regensburg, DE;
Frank Winzinger, Regensburg, DE;
Alexandra Donhauser, Regensburg, DE;
Krones AG, Neutraubling, DE;
Abstract
An apparatus for producing plastic containers includes a heating module that heats plastic preforms and a molding module for molding the preforms into containers. The heating module includes a first transport unit that transports the preforms during the heating and a first interface. The molding module is downstream of the heating module in the transport direction and includes a blow molding unit for applying a flowable medium onto the preforms for expansion thereof, a second transport unit that transports the preforms during the expansion, and a second interface. The first and second interfaces allow a mechanical connection and an electrical connection between the modules such that the molding module may be disposed on the heating module and at least one further module integrated between the heating and molding modules. The further module treats the preforms following the heating and prior to the molding.