The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

May. 24, 2012
Applicants:

Satoshi Hongo, Oita, JP;

Kenji Takahashi, Ibaraki, JP;

Kazumasa Tanida, Oita, JP;

Inventors:

Satoshi Hongo, Oita, JP;

Kenji Takahashi, Ibaraki, JP;

Kazumasa Tanida, Oita, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B31B 1/68 (2006.01); H01L 21/20 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 21/67092 (2013.01); H01L 21/76251 (2013.01); Y10T 29/413 (2013.01);
Abstract

According to one embodiment, a system for manufacturing a semiconductor device includes a spontaneous joining unit and a deformative joining unit. The spontaneous joining unit overlaps a first substrate and a second substrate and spontaneously joins mutual center portions of respective joint faces of the first substrate and the second substrate. The deformative joining unit deforms at least one peripheral portion of the respective joint faces of the first substrate and second substrate joined by the spontaneous joining unit toward the other peripheral portion and joins the mutual peripheral portions of the respective joint faces.


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