The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Mar. 13, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Sang Jin Kim, Suwon, KR;

Byung Jae Kim, Suwon, KR;

Sung Jae Lee, Suwon, KR;

Seung Hee Cho, Suwon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01);
Abstract

An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module.


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