The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Dec. 18, 2012
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Ronald Scott Bunker, Waterford, NY (US);

Scott Andrew Weaver, Ballston Lake, NY (US);

Wayne Charles Hasz, Pownal, VT (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/78 (2006.01); B21K 3/04 (2006.01); B23P 15/02 (2006.01); F02C 7/12 (2006.01); C23C 4/02 (2006.01); F01D 5/18 (2006.01);
U.S. Cl.
CPC ...
F02C 7/12 (2013.01); C23C 4/02 (2013.01); B23P 2700/06 (2013.01); F01D 5/183 (2013.01); F05D 2260/203 (2013.01);
Abstract

A manufacturing method includes providing a substrate with an outer surface and at least one interior space and machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein. Each of the one or more cooling supply holes is in fluid communication with the at least one interior space. The method further includes disposing an open cell porous metallic layer on at least a portion of the substrate. The open cell porous metallic layer is in fluid communication with the one or more cooling supply holes. A coating layer is disposed on the open cell porous metallic layer. The coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer. The substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes providing a cooling network for a component.


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