The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Feb. 07, 2008
Applicants:

Juergen Egerter, Reutlingen, DE;

Walter Roethlingshoefer, Reutlingen, DE;

Markus Werner, Deizisau, DE;

Inventors:

Juergen Egerter, Reutlingen, DE;

Walter Roethlingshoefer, Reutlingen, DE;

Markus Werner, Deizisau, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4807 (2013.01); H01L 21/4857 (2013.01); H05K 3/4667 (2013.01); H05K 1/0306 (2013.01); H05K 3/465 (2013.01); H05K 2201/09881 (2013.01); H05K 2203/0169 (2013.01); H05K 2203/1344 (2013.01); H05K 2203/1366 (2013.01);
Abstract

A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.


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