The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Feb. 02, 2010
Applicants:

Satoshi Hamatani, Higashimurayama, JP;

Keizo Akutagawa, Kodaira, JP;

Hiroshi Shima, Koganei, JP;

Inventors:

Satoshi Hamatani, Higashimurayama, JP;

Keizo Akutagawa, Kodaira, JP;

Hiroshi Shima, Koganei, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06G 7/48 (2006.01); G06F 17/50 (2006.01); G06F 7/60 (2006.01); G01N 3/00 (2006.01);
U.S. Cl.
CPC ...
G01N 3/00 (2013.01); G06F 17/5018 (2013.01); G01N 2203/0216 (2013.01); G06F 2217/80 (2013.01);
Abstract

The present invention relates to a method for predicting a deformation behavior of a rubber material capable of accurately analyzing a deformation behavior of a rubber material even in a micro level, and more specifically, to a method for predicting a deformation behavior of a rubber material, including: generating a three-dimensional model of the rubber material formed by adding a filler to a rubber; applying a configuration condition specifying a relationship between a stress and a strain on the basis of thickness information and temperature information obtained on the basis of a molecular dynamics approach to a rubber layer portion constituting the three-dimensional model; and, analyzing the deformation behavior of the rubber material. Further, in the method for predicting a deformation behavior of a rubber material, it is preferable that the deformation behavior of the rubber material is analyzed by applying a finite element method to the three-dimensional model to which the configuration condition is applied.


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