The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Oct. 01, 2013
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventor:

Jicheng Yang, North Andover, MA (US);

Assignee:

Invensense, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); B81B 7/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); H04R 9/08 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/093 (2013.01); B81C 2203/0109 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H04R 19/005 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.


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