The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Sep. 10, 2013
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Eric Ochs, Pittsburgh, PA (US);

Jay S. Salmon, Pittsburgh, PA (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 23/00 (2006.01); B81B 7/00 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 23/00 (2013.01); B81B 7/0064 (2013.01); H04R 1/04 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.


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