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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9001528 B1

PDFFull Text
Date of Patent:
Apr. 07, 2015

Filed:

Jul. 30, 2012

Shielded electronic components and method of manufacturing the same

Applicants:

Chiko Yorita, Fujisawa, JP;

Yoshihide Yamaguchi, Yokohama, JP;

Yuji Shirai, Saku, JP;

Yu Hasegawa, Sagamihara, JP;

Inventors:

Chiko Yorita, Fujisawa, JP;

Yoshihide Yamaguchi, Yokohama, JP;

Yuji Shirai, Saku, JP;

Yu Hasegawa, Sagamihara, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, JP;

Attorney:

Miles & Stockbridge P.C.

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 3/28 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 3/284 (2013.01); H05K 9/0084 (2013.01); H01L 21/568 (2013.01); H01L 23/66 (2013.01); H01L 25/165 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0218 (2013.01); H05K 3/0052 (2013.01); H05K 3/181 (2013.01); H01L 24/48 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/014 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure COin a state of protecting a back surface of the wiring board, and is electrically connected with an end portion of a ground wiring layer of the wiring board or a ground (GND) connection through-hole connected with the end portion of the ground wiring layer.

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