The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Dec. 22, 2011
Applicants:

Roberto Canegallo, Rimini, IT;

Mauro Scandiuzzo, Torrazza di Cambiago, IT;

Inventors:

Roberto Canegallo, Rimini, IT;

Mauro Scandiuzzo, Torrazza di Cambiago, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H01L 23/48 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 23/5223 (2013.01); H01L 23/642 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2224/17104 (2013.01); H01L 24/48 (2013.01); H05K 1/0239 (2013.01); H05K 3/3436 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73207 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01);
Abstract

An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding to the first surface; a second substrate having a second surface, housing a third electrical-interconnection element and a fourth electrical-interconnection element in a position corresponding to the second surface, and provided with a dielectric layer extending on top of the third interconnection element; and a first bump and a second bump made of conductive material, extending between the first electrical-interconnection element and the third electrical-interconnection element and, respectively, between the second electrical-interconnection element and the fourth electrical-interconnection element, at least partially aligned to the respective electrical-interconnection elements, the first bump being ohmically coupled to the first interconnection element and capacitively coupled to the third interconnection element, and the second bump being ohmically coupled to the second interconnection element and to the fourth interconnection element.


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