The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Feb. 21, 2012
Shinji Hiramitsu, Kashiwa, JP;
Atsushi Koshizaka, Hitachinaka, JP;
Masato Higuma, Hitachinaka, JP;
Hiroshi Tokuda, Hitachinaka, JP;
Keiji Kawahara, Hitachinaka, JP;
Shinji Hiramitsu, Kashiwa, JP;
Atsushi Koshizaka, Hitachinaka, JP;
Masato Higuma, Hitachinaka, JP;
Hiroshi Tokuda, Hitachinaka, JP;
Keiji Kawahara, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.