The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Feb. 28, 2013
Applicants:

Florian Bieck, Newport, GB;

Robert J. Montgomery, Marshfield Cardiff, GB;

Inventors:

Florian Bieck, Newport, GB;

Robert J. Montgomery, Marshfield Cardiff, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01);
Abstract

An assembler receives a circuit device and a mass of conductive material such as a diode, metal material, etc. The assembler bonds a first facing of a circuit device to a substrate. Adjacent to the circuit device, the assembler bonds a first facing of the mass of conductive material to the substrate. The assembler applies an overmold layer of insulation material over the substrate adjacent the circuit device and the mass of conductive material. Subsequent to applying the overmold layer of insulation material, the assembler provides a conductive link between a second facing of the circuit device and a second facing of the mass of conductive material.


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